NVD Vulnerability Detail
Search Exploit, PoC
CVE-2017-18328
Summary

Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016.

Publication Date Jan. 4, 2019, 12:29 a.m.
Registration Date Jan. 26, 2021, 1:20 p.m.
Last Update Nov. 21, 2024, 12:19 p.m.
CVSS3.0 : HIGH
スコア 7.8
Vector CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
攻撃元区分(AV) ローカル
攻撃条件の複雑さ(AC) 低
攻撃に必要な特権レベル(PR) 低
利用者の関与(UI) 不要
影響の想定範囲(S) 変更なし
機密性への影響(C) 高
完全性への影響(I) 高
可用性への影響(A) 高
CVSS2.0 : HIGH
Score 7.2
Vector AV:L/AC:L/Au:N/C:C/I:C/A:C
攻撃元区分(AV) ローカル
攻撃条件の複雑さ(AC) 低
攻撃前の認証要否(Au) 不要
機密性への影響(C) 高
完全性への影響(I) 高
可用性への影響(A) 高
Get all privileges. いいえ
Get user privileges いいえ
Get other privileges いいえ
User operation required いいえ
Affected software configurations
Configuration1 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
Configuration2 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
Configuration3 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9635m:-:*:*:*:*:*:*:*
Configuration4 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:*
Configuration5 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9645_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9645:-:*:*:*:*:*:*:*
Configuration6 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
Configuration7 or higher or less more than less than
cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:mdm9655:-:*:*:*:*:*:*:*
Configuration8 or higher or less more than less than
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*
Configuration9 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
Configuration10 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
Configuration11 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
Configuration12 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
Configuration13 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
Configuration14 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
Configuration15 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
Configuration16 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
Configuration17 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
Configuration18 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_636:-:*:*:*:*:*:*:*
Configuration19 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
Configuration20 or higher or less more than less than
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
Configuration21 or higher or less more than less than
cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*
Configuration22 or higher or less more than less than
cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
Configuration23 or higher or less more than less than
cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
Configuration24 or higher or less more than less than
cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:*
execution environment
1 cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-:*:*:*:*:*:*:*
Related information, measures and tools
Common Vulnerabilities List
JVN Vulnerability Information
Snapdragon Mobile および Snapdragon Wear における解放済みメモリの使用に関する脆弱性
Title Snapdragon Mobile および Snapdragon Wear における解放済みメモリの使用に関する脆弱性
Summary

Snapdragon Mobile および Snapdragon Wear には、解放済みメモリの使用に関する脆弱性が存在します。

Possible impacts 情報を取得される、情報を改ざんされる、およびサービス運用妨害 (DoS) 状態にされる可能性があります。
Solution

ベンダより正式な対策が公開されています。ベンダ情報を参照して適切な対策を実施してください。
Publication Date July 3, 2017, midnight
Registration Date Feb. 18, 2019, 5:31 p.m.
Last Update Feb. 18, 2019, 5:31 p.m.
Affected System
クアルコム
MDM9206 ファームウェア 
MDM9206 ファームウェア 
MDM9607 ファームウェア 
MDM9607 ファームウェア 
MDM9635M ファームウェア 
MDM9635M ファームウェア 
MDM9640 ファームウェア 
MDM9640 ファームウェア 
MDM9645 ファームウェア 
MDM9645 ファームウェア 
MDM9650 ファームウェア 
MDM9650 ファームウェア 
MDM9655 ファームウェア 
MDM9655 ファームウェア 
MSM8909W ファームウェア 
MSM8909W ファームウェア 
SD 210 ファームウェア 
SD 210 ファームウェア 
SD 212 ファームウェア 
SD 212 ファームウェア 
CVE (情報セキュリティ 共通脆弱性識別子)
CWE (共通脆弱性タイプ一覧)
ベンダー情報
Change Log
No Changed Details Date of change
1 [2019年02月18日]
  掲載		 Feb. 18, 2019, 5:31 p.m.