NVD Vulnerability Detail

CVE-2017-18172

Summary	In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
Publication Date	Oct. 23, 2018, 10:29 p.m.
Registration Date	Jan. 26, 2021, 1:20 p.m.
Last Update	Nov. 21, 2024, 12:19 p.m.

CVSS3.0 : HIGH
スコア	7.8
Vector	CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
攻撃元区分(AV)	ローカル
攻撃条件の複雑さ(AC)	低
攻撃に必要な特権レベル(PR)	低
利用者の関与(UI)	不要
影響の想定範囲(S)	変更なし
機密性への影響(C)	高
完全性への影響(I)	高
可用性への影響(A)	高

CVSS2.0 : HIGH
Score	7.2
Vector	AV:L/AC:L/Au:N/C:C/I:C/A:C
攻撃元区分(AV)	ローカル
攻撃条件の複雑さ(AC)	低
攻撃前の認証要否(Au)	不要
機密性への影響(C)	高
完全性への影響(I)	高
可用性への影響(A)	高
Get all privileges.	いいえ
Get user privileges	いいえ
Get other privileges	いいえ
User operation required	いいえ

Affected software configurations

Configuration1		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:mdm9635m_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:mdm9635m:-:::::::*

Configuration2		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_400_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_400:-:::::::*

Configuration3		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_410_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_410:-:::::::*

Configuration4		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_412_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_412:-:::::::*

Configuration5		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_425_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_425:-:::::::*

Configuration6		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_427_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_427:-:::::::*

Configuration7		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_430_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_430:-:::::::*

Configuration8		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_435_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_435:-:::::::*

Configuration9		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_450_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_450:-:::::::*

Configuration10		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_615_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_615:-:::::::*

Configuration11		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_616_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_616:-:::::::*

Configuration12		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_415_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_415:-:::::::*

Configuration13		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_625_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_625:-:::::::*

Configuration14		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_650_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_650:-:::::::*

Configuration15		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_652_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_652:-:::::::*

Configuration16		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_820_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_820:-:::::::*

Configuration17		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_835_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_835:-:::::::*

Configuration18		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sdm630_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sdm630:-:::::::*

Configuration19		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sdm636_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sdm636:-:::::::*

Configuration20		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sdm660_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sdm660:-:::::::*

Configuration21		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_617_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_617:-:::::::*

Configuration22		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_800_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_800:-:::::::*

Configuration23		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_810_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_810:-:::::::*

Configuration24		or higher	or less	more than	less than
cpe:2.3:o:qualcomm:sd_820a_firmware:-:::::::*
execution environment
1	cpe:2.3:h:qualcomm:sd_820a:-:::::::*

Related information, measures and tools

No	URL	タグ
1	https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components	Vendor Advisory
2	https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components	Vendor Advisory
3	https://www.qualcomm.com/company/product-security/bulletins	Vendor Advisory
4	https://www.qualcomm.com/company/product-security/bulletins	Vendor Advisory

Common Vulnerabilities List

No	CWE	Name	URL
1	CWE-190	整数オーバーフローまたはラップアラウンド	https://cwe.mitre.org/data/definitions/190.html

JVN Vulnerability Information

Snapdragon Automobile および Snapdragon Mobile における整数オーバーフローの脆弱性

Title	Snapdragon Automobile および Snapdragon Mobile における整数オーバーフローの脆弱性
Summary	Snapdragon Automobile および Snapdragon Mobile には、整数オーバーフローの脆弱性が存在します。
Possible impacts	情報を取得される、情報を改ざんされる、およびサービス運用妨害 (DoS) 状態にされる可能性があります。
Solution	ベンダより正式な対策が公開されています。ベンダ情報を参照して適切な対策を実施してください。
Publication Date	Oct. 1, 2017, midnight
Registration Date	Jan. 25, 2019, 11:40 a.m.
Last Update	Jan. 25, 2019, 11:40 a.m.

Affected System

クアルコム

MDM9635M ファームウェア

SD 400 ファームウェア

SD 410 ファームウェア

SD 412 ファームウェア

SD 415 ファームウェア

SD 425 ファームウェア

SD 427 ファームウェア

SD 430 ファームウェア

SD 435 ファームウェア

SD 450 ファームウェア

SD 615 ファームウェア

SD 616 ファームウェア

SD 617 ファームウェア

SD 625 ファームウェア

SD 650 ファームウェア

SD 652 ファームウェア

SD 800 ファームウェア

SD 810 ファームウェア

SD 820 ファームウェア

SD 820A ファームウェア

SD 835 ファームウェア

SDM630 ファームウェア

SDM636 ファームウェア

SDM660 ファームウェア

CVE (情報セキュリティ共通脆弱性識別子)

No	Name	URL
Common Vulnerabilities and Exposures (CVE)
1	CVE-2017-18172	https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2017-18172
2	CVE-2017-18172	https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2017-18172
National Vulnerability Database (NVD)
3	CVE-2017-18172	https://nvd.nist.gov/vuln/detail/CVE-2017-18172
4	CVE-2017-18172	https://nvd.nist.gov/vuln/detail/CVE-2017-18172

CWE (共通脆弱性タイプ一覧)

No	Name	URL
JVNDB
1	CWE-190	https://cwe.mitre.org/data/definitions/190.html
2	CWE-190	https://cwe.mitre.org/data/definitions/190.html

ベンダー情報

No	Name	URL
Android Open Source Project
1	Android のセキュリティに関する公開情報 - 2018 年 7 月	https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components
2	Android のセキュリティに関する公開情報 - 2018 年 7 月	https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components
Qualcomm
3	October 2018 Qualcomm Technologies, Inc. Security Bulletin	https://www.qualcomm.com/company/product-security/bulletins
4	October 2018 Qualcomm Technologies, Inc. Security Bulletin	https://www.qualcomm.com/company/product-security/bulletins

Change Log

No	Changed Details	Date of change
1	[2019年01月25日] 掲載	Jan. 25, 2019, 11:40 a.m.
1	[2019年01月25日] 掲載	Jan. 25, 2019, 11:40 a.m.